Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

Taiwan Semiconductor Manufacturing Co Ltd TSM is accelerating investments in advanced chips, packaging, and AI infrastructure ...

Taiwan Semiconductor Manufacturing Co (ADR) (NYSE:TSM), the world's largest contract chipmaker, now expects the global ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

Syenta, a next-generation semiconductor company developing advanced packaging solutions, announced it has raised $26 million in Series A funding led by Playground Global and Australia’s National ...

TSMC says the global semiconductor market could cross $1.5 trillion by 2030 as AI drives demand for advanced chips and ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in data centers.

India’s chip ambitions are moving beyond fabs toward advanced packaging, glass substrates, and chiplets technologies that ...

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Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...

Applied Materials will acquire NEXX from ASMPT Limited to enhance its panel-level advanced packaging technology for AI accelerators. The acquisition, which does not require regulatory approval, will ...